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₱5,018.00
Value RAM's KVR32S22S8/8 is a 1G x 64-bit (8GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 1Rx8, non-ECC, memory module, based on eight 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. This 260-pin DIMM uses gold contact fingers.
| • Power Supply: VDD = | 1.2V Typical |
| • VDDQ = | 1.2V Typical |
| • VPP = | 2.5V Typical |
| • VDDSPD = | 2.2V to 3.6V |
| • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals | |
| • Low-power auto self refresh (LPASR) | |
| • Data bus inversion (DBI) for data bus | |
| • On-die VREFDQ generation and calibration | |
| • Single-rank | |
| • On-board I2 serial presence-detect (SPD) EEPROM | |
| • 16 internal banks; 4 groups of 4 banks each | |
| • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) | |
| • Selectable BC4 or BL8 on-the-fly (OTF) | |
| • Fly-by topology | |
| • Terminated control command and address bus | |
| • PCB: | Height 1.18” (30.00mm) |
| • RoHS Compliant and Halogen-Free | |
| CL(IDD) | 22 cycles |
| Row Cycle Time (tRCmin) | 45.75ns(min.) |
| Refresh to Active/Refresh Command Time (tRFCmin) |
350ns(min.) |
| Row Active Time (tRASmin) | 32ns(min.) |
| UL Rating | 94 V - 0 |
| Operating Temperature | 0C to +85C |
| Storage Temperature | -55C to +100C |
₱5,018.00
Estimated delivery between June 13 and June 15.
Delivery Information
Metro Manila: 2–3 days | Provincial: 3–7 days
Main Office Branch only
Same Day Delivery
Same-Day Delivery Available
Processing starts 1–2 hours after checkout Mon–Sat | Main Office Branch only
Processing only during office hours from Main Office 9am - 5pm
₱5,018.00
₱5,018.00
Authorized Seller
100% Original Authentic Product
Value RAM's KVR32S22S8/8 is a 1G x 64-bit (8GB) DDR4-3200 CL22 SDRAM (Synchronous DRAM), 1Rx8, non-ECC, memory module, based on eight 1G x 8-bit FBGA components. The SPD is programmed to JEDEC standard latency DDR4-3200 timing of 22-22-22 at 1.2V. This 260-pin DIMM uses gold contact fingers.
| • Power Supply: VDD = | 1.2V Typical |
| • VDDQ = | 1.2V Typical |
| • VPP = | 2.5V Typical |
| • VDDSPD = | 2.2V to 3.6V |
| • Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals | |
| • Low-power auto self refresh (LPASR) | |
| • Data bus inversion (DBI) for data bus | |
| • On-die VREFDQ generation and calibration | |
| • Single-rank | |
| • On-board I2 serial presence-detect (SPD) EEPROM | |
| • 16 internal banks; 4 groups of 4 banks each | |
| • Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) | |
| • Selectable BC4 or BL8 on-the-fly (OTF) | |
| • Fly-by topology | |
| • Terminated control command and address bus | |
| • PCB: | Height 1.18” (30.00mm) |
| • RoHS Compliant and Halogen-Free | |
| CL(IDD) | 22 cycles |
| Row Cycle Time (tRCmin) | 45.75ns(min.) |
| Refresh to Active/Refresh Command Time (tRFCmin) |
350ns(min.) |
| Row Active Time (tRASmin) | 32ns(min.) |
| UL Rating | 94 V - 0 |
| Operating Temperature | 0C to +85C |
| Storage Temperature | -55C to +100C |
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