Description
Features
Compact Low-Profile Heatsink Design
Customizable RGB light effects
Create Personalized Lightshow with XPG Prime
PMIC for power supply stability
On-die ECC error correction
High-quality materials for stable overclocking
Supports Intel® XMP 3.0 and AMD EXPO for easy overclocking
SPECIFICATION
Memory Type
DDR5
Form Factor
U-DIMM
Color
Black / White
Capacity
32GB
Speeds
6400 MT/s
CAS Latencies
32
Operating Voltage
1.1-1.4V
Operating Temperature
0°C to 85°C
Dimensions (L x W x H)
133.35 x 40 x 7.86mm
FEATURES
Power Supply:
VDD = 1.2V Typical
VDDQ =
1.2V Typical
VPP =
2.5V Typical
VDDSPD =
2.2V to 3.6V
Nominal and dynamic on-die termination (ODT) for
data, strobe, and mask signals
Low-power auto self refresh (LPASR)
Data bus inversion (DBI) for data bus
On-die VREFDQ generation and calibration
Single-rank
On-board I2 serial presence-detect (SPD) EEPROM
16 internal banks; 4 groups of 4 banks each
Fixed burst chop (BC) of 4 and burst length (BL) of 8
via the mode register set (MRS)
Selectable BC4 or BL8 on-the-fly (OTF)
Fly-by topology
Terminated control command and address bus
PCB:
Height 1.18” (30.00mm)
RoHS Compliant and Halogen-Free
Description
Simple design to perfectly protect the cooling module
High thermal conductive adhesive
Supports Intel & AMD motherboards
Selected high-quality IC
Supports XMP2.0
Energy saving with ultra-low working voltage
Specification
Details
Capacity
32GB (2 x 16GB)
Speed
3600 MHz (PC4-28800)
Timing
CL18-22-22 (Some sources list CL18-20-20, refer to the product page for exact specs)
Voltage
1.35V – 1.5V
Type
Unbuffered Non-ECC UDIMM
XMP Support
Yes, XMP 2.0
Heatsink
Metal Heatsink
RGB Lighting
Yes, with various lighting effects and software control options
Dimensions
133.35 x 40 x 8mm
Weight
46g
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On-Die ECC Ensures Secure Transmissions: On-die Error Correcting Code (ECC) automatically rectifies data errors, fortifying the memory module's error tolerance and ensuring secure and stable data transmissions.
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