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₱8,000.00
| Key Technical Specifications: | |
| Module Type: | 288-Pin Unbuffered DIMM Non-ECC |
| Capacity: | 16GB Kit (2x8GB) or 32GB Kit (2x16GB) |
| Frequency: | 3200 MHz (PC4-25600) |
| Latency: | CL16-18-18-38 |
| Voltage: | 1.35V |
| Dimensions: | 43.5(H) x 141(L) x 8.3(W) mm |
| Compatibility: | Optimized for AMD Ryzen platforms (B550/X570) and Intel (Z390/Z490/Z590) |
| Features: | High-conductivity thermal adhesive, aluminum alloy heat sink, optimized for overclocking (XMP 2.0) |
₱8,000.00
Estimated delivery between June 11 and June 13.
Delivery Information
Metro Manila: 2–3 days | Provincial: 3–7 days
Main Office Branch only
Same Day Delivery
Same-Day Delivery Available
Processing starts 1–2 hours after checkout Mon–Sat | Main Office Branch only
Processing only during office hours from Main Office 9am - 5pm
₱8,000.00
₱8,000.00
Authorized Seller
100% Original Authentic Product
| Key Technical Specifications: | |
| Module Type: | 288-Pin Unbuffered DIMM Non-ECC |
| Capacity: | 16GB Kit (2x8GB) or 32GB Kit (2x16GB) |
| Frequency: | 3200 MHz (PC4-25600) |
| Latency: | CL16-18-18-38 |
| Voltage: | 1.35V |
| Dimensions: | 43.5(H) x 141(L) x 8.3(W) mm |
| Compatibility: | Optimized for AMD Ryzen platforms (B550/X570) and Intel (Z390/Z490/Z590) |
| Features: | High-conductivity thermal adhesive, aluminum alloy heat sink, optimized for overclocking (XMP 2.0) |
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