| Type |
M.2 2280 |
| Dimensions |
Double-sided 80 mm × 22 mm × 3.58 mm (3.15" × 0.87" × 0.14") |
| Weight |
10 g (0.35 oz) |
| Bus Interface |
NVMe PCIe Gen3 x4 |
| Flash Type |
3D NAND flash |
| Capacity |
256 GB / 512 GB / 1 TB / 2 TB |
| Operating Temperature |
0°C (32°F) ~ 70°C (158°F) |
| Operating Voltage |
3.3V ± 5% |
| Sequential Read/Write (CrystalDiskMark) |
2 TB: Up to 3,500 / 2,900 MB/s
1 TB: Up to 3,500 / 3,200 MB/s
512 GB: Up to 3,500 / 2,500 MB/s
256 GB: Up to 3,300 / 1,250 MB/s |
| 4K Random Read/Write (IOmeter) |
2 TB: Up to 340,000 / 360,000 IOPS
1 TB: Up to 330,000 / 370,000 IOPS
512 GB: Up to 190,000 / 360,000 IOPS
256 GB: Up to 190,000 / 300,000 IOPS |
| Terabytes Written (TBW) |
2 TB: 4,400 TBW
1 TB: 2,200 TBW
512 GB: 1,100 TBW
256 GB: 550 TBW |
| MTBF (Mean Time Between Failures) |
2,000,000 hours |
| DWPD (Drive Writes Per Day) |
1.2 (5 years) |
| Performance Notes |
Speed may vary depending on hardware, software, usage, and capacity.
DWPD workload may differ from actual usage.
TBW represents endurance for highest capacity models.
Some motherboards provide only PCIe x2 connections for M.2 slots, limiting performance. |
| Operating System Compatibility |
Microsoft Windows 7 or later
Linux Kernel 2.6.31 or later |
| Compatibility Note |
Systems must have an M.2 connector with an M key. B-key connectors are not compatible. Improper insertion may cause damage. |
| Technology Features |
S.M.A.R.T.
Advanced Garbage Collection
RAID Engine
LDPC Coding
DRAM Cache |
