| OVERVIEW |
|
| Interface |
PCIe® 4.0 x4 / 5.0 x2 NVMe™ 2.0 |
| Application
|
Client PCs |
| Weight
|
Max 9.0g Weight |
| Dimensions
|
Max 80.15 x Max 22.15 x Max 2.38 mm |
| GENERAL FEATURES |
|
| Application
|
Client PCs |
| Capacity |
2,000GB (1GB=1 billion byte by IDEMA) * Actual usable capacity may be less (due to formatting, partitioning, operating system, applications or otherwise) |
| Form Factor
|
M.2 (2280) |
| Interface |
PCIe® 4.0 x4 / 5.0 x2 NVMe™ 2.0 |
| Storage Memory |
Samsung V-NAND TLC |
| Controller |
Samsung in-house Controller |
| Cache Memory |
HMB (Host Memory Buffer) |
| SPECIAL FEATURES |
|
| TRIM Support |
Supported |
| S.M.A.R.T. Support |
Supported |
| GC (Garbage Collection) |
Auto Garbage Collection Algorithm |
| Encryption Support |
AES 256-bit Encryption (Class 0) TCG/Opal IEEE1667 (Encrypted drive) |
| WWN Support |
Not supported |
| Device Sleep Mode Support |
Yes |
| PERFORMANCE |
|
| Sequential Read |
Up to 7,250 MB/s * Performance may vary based on system hardware & configuration |
| Sequential Write |
Up to 6,300 MB/s * Performance may vary based on system hardware & configuration |
| Random Read |
Up to 1,000,000 IOPS * Performance may vary based on system hardware & configuration |
| Random Write |
Up to 1,350,000 IOPS * Performance may vary based on system hardware & configuration |
| ENVIRONMENT |
|
| Average Power Consumption
|
Average: Read 4.6 W / Write 4.2 W* Actual power consumption may vary depending on system hardware & configuration |
| Power Consumption (Idle)
|
Typical 60 mW * Actual power consumption may vary depending on system hardware & configuration |
| Power Consumption (Device Sleep)
|
Typical 5 mW * Actual power consumption may vary depending on system hardware & configuration |
| Allowable Voltage |
3.3 V ± 5 % Allowable voltage |
| Reliability
|
1.5 million Hours Reliability (MTBF) |
| Operating Temperature |
0 - 70 ℃ Operating Temperature |
| Shock
|
1,500 G & 0.5 ms (Half sine) |