Category
Specification
Feature
TUF Gaming Alliance CertifiedAsymmetric cutting design heat spreaderHigh quality aluminum forged heat spreader all-covered1.2V~1.35V ultra low working voltageSupport Intel XMP 2.0 smart overclocking technologySelected high quality IC chipsLifetime warranty
Caution
Before purchasing memory products, please refer to the QVL (Qualified Vendor List) compatibility list first of the motherboard.The quality of the CPU memory controller (IMC) and the version from the BIOS of motherboard may both potentially affect the operating frequency of the memory.
General specifications
Model:
A440 Lite
Capacity:
512GB
Interface:
PCIe Gen4x4 with NVMe
Controller:
Phison PS5027-E27T
NAND Type:
162-layer TLC NAND
DRAM Cache:
None (uses Host-Memory-Buffer (HMB))
Dimensions:
80.0(L)×22.0(W)×3.7(H) mm80.0 open paren cap L close paren cross 22.0 open paren cap W close paren cross 3.7 open paren cap H close paren mm
80.0(𝐿)×22.0(𝑊)×3.7(𝐻) mm
Weight:
7g
Endurance:
300 TBW
Warranty:
5 Years
Performance
Sequential Read:
Up to 7,000 MB/s
Sequential Write:
Up to 4,500 MB/s
Other specs
Shock Resistance:
1,500G/0.5ms
Vibration Resistance:
80Hz~2,000Hz/20G
MTBF:
1,500,000 Hours
Operating Temperature:
0∘C0 raised to the composed with power cap C
0∘𝐶
to
70∘C70 raised to the composed with power cap C
70∘𝐶
Storage Temperature:
-40∘Cnegative 40 raised to the composed with power cap C
−40∘𝐶
to
85∘C85 raised to the composed with power cap C
85∘𝐶
Heat Sink:
Pre-installed ultra-thin graphene heat sink
Ultimate Read/Write Performance
Storage Expandable across Platforms with Ultra-slim Size for Easy Installation
Preset Controller Solution for Optimal Quality
Optimized Performance Offers Reliability and Long Lifespan
S.M.A.R.T. Monitoring System
Be Eco-friendly and Conserve the Earth
Patented Graphene Heat SinkInvention patent number in the US: US11051392B2Invention patent number in Taiwan: I703921Utility model patent number in China: CN 211019739 U
Patented S.M.A.R.T. SoftwareInvention patent number in Taiwan: I751753
Specification
Details
Model
VULCAN Z T253TZ002T0C101
Capacity
2TB
Interface
SATA Rev. 3.0 (6Gb/s)
Form Factor
2.5"
Memory Type
3D NAND TLC
Read Speed
Up to 550 MB/s
Write Speed
Up to 500 MB/s
Endurance
1600TBW
Dimensions
100(L) x 69.9(W) x 7(H)mm
Weight
45g
DRAM Cache
No
Warranty
3-Year Limited
Key Features
S.M.A.R.T. support, SLC caching, LDPC, Windows TRIM support
3D NAND best upgrade option for gaming
Equipped with a 3D flash memory chip for a fast and seamless gaming experience superior to traditional HDDs, making it the best entry-level SSD for new gamers venturing into the world of gaming.
Enhanced performance for seamless cutscenes
Supports smart SLC caching algorithm for ultra-fast transmission speeds that is 4X faster than traditional HDDs to deliver seamless cutscenes.
Smart optimization to ensure reliable performance
Supports S.M.A.R.T. technology for SSD monitoring and Windows TRIM for optimized performance to ensure reliable SSD performance. The built-in ECC and Wear-Leveling technology also deliver a safe and reliable space for storing data.
Shock-resistant, vibration-resistant, and reduced noise interference
Compared to traditional HDDs, the VULCAN Z SSD has better shock-resistance and vibration-resistance as well as lower power consumption and noise interference to ensure users always feel safe storing games on the VULCAN Z SSD.
Performance and specifications
Capacity:
1TB
Sequential Read:
Up to 550 MB/s
Sequential Write:
Up to 500 MB/s
Terabytes Written (TBW):
800 TBW
Mean Time Between Failures (MTBF):
1,000,000 hours
Interface:
SATA Rev. 3.0 (6Gb/s)
Form Factor:
2.5-inch
Dimensions:
100mm×69.9mm×7mm100 mm cross 69.9 mm cross 7 mm
100mm×69.9mm×7mm
Weight: 45g
Durability and features
Shock Resistance:
1500G at 0.5ms
Vibration Resistance:
20G (non-operating)
Technology:
3D NAND TLC, SLC caching, S.M.A.R.T. technology, Windows TRIM, and ECC
Power Consumption:
Lower power consumption
Other:
Noise reduction, shock-resistant, and vibration-resistant
Operating conditions
Operating Temperature:
0∘C0 raised to the composed with power C
0∘C
to
70∘C70 raised to the composed with power C
70∘C
Storage Temperature:
-40∘Cnegative 40 raised to the composed with power C
−40∘C
to
85∘C85 raised to the composed with power C
85∘C
Humidity:
5% ~ 95% RH, non-condensing
Digital Storage Capacity
256 GB
Hard Disk Interface
PCIE x 4
Connectivity Technology
PCIe
Brand
TEAMGROUP
Special Feature
Portable
Hard Disk Form Factor
2280 Inches
Hard Disk Description
Solid State Drive
Compatible Devices
Laptop, Desktop
Installation Type
Internal Hard Drive
Hard Disk Size
512 GB
Descriptions:
Sleek Design
Reinforced Structure for Better Cooling
Supports Intel XMP3.0 for One-Click Overclocking
Power Management ICs (PMICs) Equipped for Stable, Efficient Power Usage
Strengthened PMIC Cooling Design
On-die ECC for Stable Systems
High-Quality ICs Selected for Stability & Reliability
Sleek DesignFor the T-FORCE VULCAN DDR5, TEAMGROUP has adopted a gorgeous streamlines design with multi-angular to overall outline for visual aesthetics and showcase VULCAN DDR5’s unique features, delivering a sleek OC gaming memory that packs a powerful performance.
Reinforced StructureThe VULCAN DDR5 is molded from a single block of aluminum alloy through stamping and the top structure is fixed with a snap fastener.
Better CoolingTEAMGROUP uses a professional-grade thermal conducting silicon to reinforce adhesion between the cooling fin and memory. The silicon also allows for incredible cooling as it transfers the heat from top to bottom rapidly, ensuring that the memory remains at the optimal operating temperature.
Supports Intel XMP3.0 for One-Click OverclockingSupports the latest Intel XMP3.0 and one-click overclocking technology; users can experience ultra-fast overclocking speeds at a single click.
Strengthened PMIC Cooling DesignThe VULCAN DDR5 is equipped with professional thermal conductive silicon, make PMIC cooling design for more effective, and stable PMIC operations.
Power Management ICs (PMICs) Equipped for Stable, Efficient Power UsageThe VULCAN DDR5 memory is equipped with PMIC, minimizing noise interference ensuring stable, efficient power distribution across all components for rapid, and reliable power supply.
On-die ECC for Stable SystemThe VULCAN DDR5 memory supports on-die ECC, which offers error correction and detection to ensure that system stability is not compromised for performance.
High-Quality ICs Selected for Stability & ReliabilityTEAMGROUP has selected a high-quality IC die that has undergone comprehensive compatibility and reliability testing to ensure an OC gaming memory that delivers both stability and compatibility.
Specification :
Model Number
FLBD516G5200HC40C01
Memory Type
VULCAN DDR5 DESKTOP MEMORY
Capacity
16GB (16GBx1)
Tested Speed
5200MHz
Tested Latency
CL40
Data Transfer Bandwidth
41600 MB/s
Tested Voltage
1.25 V
Product Description
A new choice for gaming upgrade
T-FORCE G50 Pro / G50 PCIe4.0 SSD adopt PCIe Gen4x4 interface. Having read and write speeds reaching 5000 MB/s, the SSDs allow users to enjoy gaming on a new level with easy upgrades and storage capacity increase.
Preset controller solutions
T-FORCE G50 Pro / G50 PCIe4.0 SSD use InnoGrit controller solutions by default, allowing users a peace of mind in their usage experience.
Different caching grading systems to cover users' needs
The SSDs come with different grading systems to suit different needs: T-FORCE G50 Pro PCIe4.0 SSD supports DRAM Caching and SLC Caching, whereas T-FORCE G50 PCIe4.0 SSD only supports SLC Caching. Choose the one that suits you best.
Ultra-thin graphene heat-sink makes installations painless
The patented ultra-thin heat-sink is made from the optimal heat conductive material—graphene, offering painless, interference-free installations on gaming PCs, gaming, laptops, and PS5 consoles.
Brand
TEAMGROUP
Series
G50
Item model number
TM8FFE001T0C129
Item Weight
0.247 ounces
Product Dimensions
0.87 x 3.15 x 0.15 inches
Item Dimensions LxWxH
0.87 x 3.15 x 0.15 inches
Color
Black
Computer Memory Type
DIMM
Flash Memory Size
1 TB
Hard Drive Interface
PCIE x 4
Manufacturer
TEAMGROUP
