AORUS Gen4 7300 SSD 1TB Key specifications Interface:  PCI-Express 4.0 x4, NVMe 1.4 Form Factor:  M.2 2280 Capacity:  1000GB Sequential Read Speed:  Up to 7300 MB/s Sequential Write Speed:  Up to 6000 MB/s NAND Flash:  3D TLC NAND Flash External DDR Cache:  1GB DDR4L Controller:  Phison E18 Heatsink:  Included Dimensions (with heatsink):  80.5 x 23.5 x 11.25 mm MTBF:  1.6 million hours Warranty:  Limited 5-year or 700 TBW (Total Bytes Written)  Extremely fast PCIe 4.0 throughput AORUS Gen4 7300 SSD delivers sequential read up to 7.3GB/s with 8 Channel controller- Phison E18- and 3D TLC NAND. The E18 controller is built with the advanced 12nm process ensuring sufficient computing power. Also it supports up to 8 NAND Flash channel with 32CE, DDR4 SLC caching and meets NVMe 1.4. * Performance may vary based on system hardware & configuration.** Test system configuration: AM5 X670(AMD Ryzen 9) + PCIe 4.0x4, NVMe 1.4 Interface + DDR4 DRAM cache + 8 CH with 32 CEs + Supports SMART an NAND Flash Selected for High Quality and Performance Selected High Speed 3D TLC NAND Flash (1600+ MT/s) The ultra high speed 3D TLC NAND Flash is operating at 1600+ MT/s, which is 50% more than the prevision version that leads to better performance. 2X 1600+ MT/s NAND Flash Speed (MT/s)   Xtreme Storage Performance By adopting Phison E18 controller and 3D TLC NAND, AORUS Gen4 7300 SSD delivers blazing speeds: up to 7,300 MB/s for sequential read, and up to 6,000MB/s sequential write. Sequential Read performance of PCIe 4.0 SSDs is 2 times faster than the PCIe 3.0 SSDs. Get ready to enter the next generation of computing with faster and smoother, gaming, streaming, and graphics intensive rendering. Optimized Aluminum Heat Spreaders with Nanocarbon Coating for 20% Cooler Challenged passive cooling to maximize surface area for heat dissipation with advanced thermal technology Nanocarbon coating. Applied with dual side high conductivity thermal pad ensures the heat transferring to the heatsink. The 7mm height heatsink is compatible with all the M.2 slots including the one under graphic card. Efficient Heat Spreader Design Compared with regular heat spreader, the new high efficient heat spreader improves thermal dissipation to extend 46% more time running at high speed. In addition, compared to the one without heatsink, AORUS Gen4 7300 SSD running 5 times longer at 7.3GB/s. Enjoy the smoother & upgraded storage performance.    Why is keeping an SSDs at lower temperatures so important? Higher working temperature may cause data loss. The degradation factor of data loss could be a hundred times higher. With Heat Spreaders, the AORUS Gen4 7300 SSD can operate at lower working temperatures to improve data storage reliability. Furthermore, SSDs can running at extreme performance longer. AORUS Gen4 7300 SSD meets SSD expansion requirements of PS5 AORUS Gen4 7300 SSD with Aluminum Heat Spreaders meets the required performance and dimensions of PS5 M.2 SSD.Adopting by Aluminum Heat Spreaders with Nanocarbon Coating, AORUS Gen4 7300 SSD improves thermal dissipation and helps to prevent throttling. AORUS Gen4 7300 SSD is fully reach ps5 requirement and give the best gaming experience.Looking for the best partner for your PS5? Enjoy the thrilling gaming experience by applied AORUS Gen4 7300 SSD to your PS5 to expand more capacities. GIGABYTE CONTROL CENTER (GCC)   GIGABYTE CONTROL CENTER (GCC) is a unified software for all GIGABYTE supported products. It provides newly designed intuitive user interface to control all essential function. Unified software platform for all Gigabyte supported products Intuitive user interface for an eased experience Modularized control components only for installed hardware Auto update function to keep system up to date and support future products. Specification Interface PCI-Express 4.0 x4, NVMe 1.4 Form Factor M.2 2280 Total Capacity 1000GB NAND 3D TLC NAND Flash External DDR Cache DDR4 1GB Sequential Read speed Up to 7300 MB/s Sequential Write speed Up to 6000 MB/s Dimension SSD without Heatsink: 80 x 22 x 2.3 mm (Single Side)SSD with Heatsink: 80.5 x 23.5 x 11.25 mm Mean time between failure (MTBF) 1.6 million hours Max. Operating Power Read: 6.6WWrite: 6.7W Power Consumption (Idle, PS3) 30mW Power Consumption(PS4, L1.2) 3mW Temperature (Operating) 0°C to 70°C Temperature (Storage) -40°C to 85°C Warranty 1. Limited 5-years or 700TBW. 2. Limited warranty based on 5 years or 700TBW, whichever comes first. (*TBW is evaluated by JEDEC workload standard. )*TBW (Terabyte Written): Terabytes Written is the total amount of data that can be written into a SSD before it is likely to fail. 3. When the usage of an NVME SSD as indicated by the "Percentage Used" (SMART ID: 05) in SMART page of "GIGABYTE SSD toolbox" reaches 100 means out of warranty. (A new unused product will show the number of 0) Note • Test system configuration: configuration may vary by models, we will choose the latest platform for verification. • Performance may vary based on SSD's firmware version and system hardware & configuration. Sequential performance measurements based on CrystalDiskMark and IOmeter 1.1.0. • Speeds based on internal testing. Actual performance may vary. • 1GB = 1 billion bytes. Actual useable capacity may vary. Test Configuration OS: Windows 11 22H2 (OS build 22621.819)CPU: AMD Ryzen 9 7950X 16-Core Processor 4.5GMemory: DDR5 5600 16GBx2Chipset: AM5 X670 (X670E AORUS MASTER)

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Specification CPU AMD Socket AM5, support for: AMD Ryzen™ 9000 Series Processors/ AMD Ryzen™ 8000 Series Processors/ AMD Ryzen™ 7000 Series Processors (Go to GIGABYTE's website for the latest CPU support list.) Chipset AMD X870E Memory Support for DDR5 8200(OC) / 8000(OC) / 7800(OC) / 7600(OC) / 7200(OC) / 7000(OC) / 6800(OC) / 6666(OC) / 6600(OC) / 6400(OC) / 6200(OC) / 6000(OC) / 5600(OC) / 5200 / 4800 / 4400 MT/s memory modules 4 x DDR5 DIMM sockets supporting up to 256 GB (64 GB single DIMM capacity) of system memory Dual channel memory architecture Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for AMD EXtended Profiles for Overclocking (AMD EXPO™) and Extreme Memory Profile (XMP) memory modules (The CPU and memory configuration may affect the supported memory types, data rate (speed), and number of DRAM modules, please refer to "Memory Support List" on GIGABYTE's website for more information.) Onboard Graphics Integrated Graphics Processor with AMD Radeon™ Graphics support+ASMedia USB4® Controller: - 2 x USB4® USB Type-C® ports, supporting USB4 and DisplayPort video outputs and a maximum resolution of 3840x2160@240 Hz * Support for DisplayPort 1.4 version and HDR. Integrated Graphics Processor with AMD Radeon™ Graphics support: - 1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz * Support for HDMI 2.1 version, HDCP 2.3, and HDR. ** Support for native HDMI 2.1 TMDS compatible ports. - 1 x front HDMI port, supporting a maximum resolution of 1920x1080@30 Hz * Support for HDMI 1.4 version (Graphics specifications may vary depending on CPU support.) Audio Realtek® ALC1220 CODEC * The back panel line out jack supports DSD audio. High Definition Audio 2/4/5.1/7.1-channel * You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings. Support for S/PDIF Out LAN Realtek® 2.5GbE LAN chip (2.5 Gbps/1 Gbps/100 Mbps) Wireless Communication module Qualcomm® Wi-Fi 7 QCNCM865 - 802.11a, b, g, n, ac, ax, be, supporting 2.4/5/6 GHz carrier frequency bands - BLUETOOTH 5.3 - Support for 11be 320MHz wireless standard (Actual data rate may vary depending on environment and equipment.) * Wi-Fi 7 features require Windows 11 SV3 to function properly. (There is no support driver for Windows 10.) ** Wi-Fi 7 channels on 6 GHz band availability depends on individual country's regulations. Expansion Slots 1x PCI Express x16 slot (PCIEX16), integrated in the CPU: AMD Ryzen™ 9000/7000 Series Processors support PCIe 5.0 x16 mode * The M2B_CPU and M2C_CPU connectors share bandwidth with the PCIEX16 slot. When theM2B_CPU orM2C_CPU connector is populated, the PCIEX16 slot operates at up to x8 mode. AMD Ryzen™ 8000 Series-Phoenix 1 Processors support PCIe 4.0 x8 mode AMD Ryzen™ 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4 mode (The PCIEX16 slot can only support a graphics card or an NVMe SSD. If only one graphics card is to be installed, be sure to install it in the PCIEX16 slot.) Chipset: - 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x4 (PCIEX4_1) - 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x4 (PCIEX4_2) Storage Interface 1 x M.2 connector (M2A_CPU), integrated in the CPU, supporting Socket 3, M key, type 25110/22110/2580/2280 SSDs: AMD Ryzen™ 9000/7000 Series Processors support PCIe 5.0 x4/x2 SSDs AMD Ryzen™ 8000 Series-Phoenix 1 Processors support PCIe 4.0 x4/x2 SSDs AMD Ryzen™ 8000 Series-Phoenix 2 Processors support PCIe 4.0 x4/x2 SSDs 2 x M.2 connectors (M2B_CPU, M2C_CPU), integrated in the CPU, supporting Socket 3, M key, type 22110/2280 SSDs: AMD Ryzen™ 9000/7000 Series Processors support PCIe 5.0 x4/x2 SSDs * The M2B_CPU and M2C_CPU connectors will become unavailable when using the AMD Ryzen™ 8000 Series-Phoenix 1/Phoenix 2 Processors. 1 x M.2 connector (M2D_SB), integrated in the Chipset, supporting Socket 3, M key, type 22110/2280 PCIe 4.0 x4/x2 SSDs 4 x SATA 6Gb/s connectors RAID 0, RAID 1, RAID 5, and RAID 10 support for NVMe SSD storage devices * RAID 5 is only available on AMD Ryzen™ 9000 Series Processors. RAID 0, RAID 1, and RAID 10 support for SATA storage devices USB CPU+ASMedia USB4® controller: - 2 x USB4® USB Type-C® ports on the back panel CPU: - 1 x USB 3.2 Gen 2 Type-A port (red) on the back panel Chipset: - 1 x USB Type-C® port with USB 3.2 Gen 2x2 support, available through the internal USB header - 2 x USB 3.2 Gen 2 Type-A ports (red) on the back panel - 8 x USB 3.2 Gen 1 ports (4 ports on the back panel, 4 ports available through the internal USB headers) - 6 x USB 2.0/1.1 ports (2 ports on the back panel, 4 ports available through the internal USB headers) Internal I/O Connectors 1 x 24-pin ATX main power connector 2 x 8-pin ATX 12V power connectors 1 x CPU fan header 1 x CPU fan/water cooling pump header 4 x system fan headers 2 x system fan/water cooling pump headers 3 x addressable RGB Gen2 LED strip headers 1 x RGB LED strip header 4 x SATA 6Gb/s connectors 4 x M.2 Socket 3 connectors 1 x front panel header 1 x front panel audio header 1 x USB Type-C® header, with USB 3.2 Gen 2x2 support 2 x USB 3.2 Gen 1 headers 2 x USB 2.0/1.1 headers 1 x noise detection header 1 x HDMI port (Note) 1 x Trusted Platform Module header (For the GC-TPM2.0 SPI/GC-TPM2.0 SPI2.0/GC-TPM2.0 SPI V2 module only) 1 x power button 1 x reset button 2 x temperature sensor headers 1 x reset jumper 1 x Clear CMOS jumper Back Panel Connectors 1 x Q-Flash Plus button 2 x USB 2.0/1.1 ports 1 x HDMI port (Note) 4 x USB 3.2 Gen 1 ports 2 x USB4® USB Type-C® port (DisplayPort (Note)) 3 x USB 3.2 Gen 2 Type-A ports (red) 1 x RJ-45 port 2 x antenna connectors (2T2R) 1 x optical S/PDIF Out connector 2 x audio jacks I/O Controller iTE® I/O Controller Chip H/W Monitoring Voltage detection Temperature detection Fan speed detection Water cooling flow rate detection Fan fail warning Fan speed control * Whether the fan (pump) speed control function is supported will depend on the fan (pump) you install. Noise detection BIOS 1 x 256 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0 Unique Features Support for GIGABYTE Control Center (GCC) * Available applications in GCC may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications. Support for Q-Flash Support for Q-Flash Plus Support for Smart Backup Bundled Software Norton® Internet Security (OEM version) LAN bandwidth management software Operating System Support for Windows 11 64-bit Form Factor ATX Form Factor; 30.5cm x 24.4cm

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