Features
Compact Low-Profile Heatsink Design
Top Quality RAM for High Durability
Higher Performance and Reliability
Works with the Latest AMD Platforms
Supports Intel® XMP 2.0 for easy overclocking
RoHS compliant
SPECIFICATIONS
Heatsink Color:
White
Speed:
DDR4 3200 MT/s
CAS Latencies:
16-20-20
Module size:
16GB
Operating temperature:
0°C to 85°C
Storage temperature:
-20°C to 65°C
Operating voltage:
1.35V
Compatibility:
DDR4 2666 CL19-19-19 at 1.2V
Dimensions (LxWxH):
133.35 x 34 x 5.9mm
Weight:
28.41g
Upgrade your desktop performance with the XPG GAMMIX D35 8GB DDR4-3200 BLACK memory module. Featuring DDR4 technology and an impressive 3200 MHz speed, this memory is designed for high-speed computing and smooth multitasking. With a capacity of 8GB, it’s ideal for gaming, content creation, and other memory-intensive tasks.
With a CAS latency of 16, this module ensures fast data access for quick load times and efficient performance. The 1.35V operating voltage contributes to a more energy-efficient system, providing power savings without compromising speed. The 0°C to 85°C operating temperature range ensures the module maintains optimal performance even under demanding conditions.
The XPG GAMMIX D35 features a sleek black design that fits well with a variety of system builds, making it as stylish as it is functional. Measuring just 133.35 x 34 x 5.9mm, it is a compact solution that fits into most desktop setups with ease. Enhance your system with the XPG GAMMIX D35 8GB DDR4-3200 BLACK for high-speed performance and reliable memory that complements your build.
SPECIFICATIONS
Memory Type:
DDR4
Form Factor:
U-DIMM
Color:
Black
Capacity:
8GB
Speeds:
3200MHz
CAS Latencies:
16
Operating Voltage:
1.35V
Operating Temperature:
0°C to 85°C
Dimensions (L x W x H):
133.35 x 34 x 5.9 mm
Weight:
27.34g
Features
Compact Low-Profile Heatsink Design
Top Quality RAM for High Durability
Higher Performance and Reliability
Works with the Latest AMD Platforms
Supports Intel® XMP 2.0 for easy overclocking
RoHS compliant
SPECIFICATIONS:
Heatsink Color:
White
Speed:
DDR4 3200 MT/s
CAS Latencies:
16-20-20
Module size:
8GB
Operating temperature:
0°C to 85°C
Operating temperature:
0°C to 85°C
Storage temperature:
-20°C to 65°C
Operating voltage:
1.35V
Compatibility:
DDR4 2666 CL19-19-19 at 1.2V
Dimensions (LxWxH):
133.35 x 34 x 5.9mm
Weight:
27.34g
Description:
Each Apacer memory has been through several manual testing procedures to ensure that it can be used in a variety of application contexts and offer customers a computer experience that is both high-performing and stable. Whether they are casual users, gamers, or computer fanatics, they can all experience how Apacer memory improves computer performance.
Specification of Apacer 8GB DDR4 2666MHz Memory Sodimm
Frequency:
2666MHz
Capacity:
8GB
Voltage:
1.2V
Cas Latency:
CL19
PIN:
260-Pin
Module Height:
30.00mm/ 1.181 Inch
Introducing the Crucial Ballistix BLS4G4D26BFSE 4Gb DDR4 2666MHz RAM
The Crucial Ballistix 4GB DDR4 2666MHz RAM is designed for performance enthusiasts. Gamers and anyone who simply wants to get more out of their system. Ballistix ® Sport LT DDR4 memory will help you do just that. Give your processor the resources it needs to do so. And make your computer faster and more responsive.
Specifications:
Manufacturer:
Crucial
Model:
BLS4G4D26BFSE (Red)
RAM Standard:
DDR4
Bus Support:
2666MHz
Capacity:
4 GB (1x4GB)
Voltage:
1.2V
Latency:
CL16
Overclock:
Yes
Feel the Rush of Ripjaws V
Ripjaws V series DDR4 DRAM memory is designed for sleek aesthetics and performance, making it an ideal choice for building a new PC system or for upgrading your system memory.
Experience DDR4 Performance
Available in a wide range of frequency options, Ripjaws V series lets you enjoy a computing experience at DDR4 speeds for gaming, video & image editing, rendering, and data processing.
Rigorously Tested
The Ripjaws V DDR4 memory series is tested under G. SKILL's rigorous validation process to ensure outstanding quality.
42mm Module Height
Designed with a 42mm module height, the Ripjaws V series memory is ideal for use with large CPU coolers*.
SPECIFICATIONS
Memory Type:
DDR4
Capacity:
32GB (16GBx2)
Multi-Channel Kit:
Dual Channel Kit
OC Profile Support:
Intel XMP 2.0
Tested Speed (XMP):
3200 MT/s
Tested Latency (XMP):
16-18-18-38
Tested Voltage (XMP):
1.35V
Registered/Unbuffered:
Unbuffered
Error Checking (ECC):
Non-ECC
SPD Speed (Default):
2133 MT/s
SPD Voltage (Default):
1.20V
Fan Included:
No
Features:
Intel XMP 2.0 (Extreme Memory Profile) Ready
AMD B450 Ultra Durable Motherboard with GbE LAN and Bandwidth Management, PCIe Gen3 x4 M.2, Anti-Sulfur Resistor Design
Supports AMD Ryzen™ 5000 series / Ryzen™ 5000 G-Series/ 3rd Gen Ryzen™/ 2nd Gen Ryzen™/ 1st Gen Ryzen™/ 2nd Gen Ryzen™ with Radeon™ Vega Graphics/ 1st Gen Ryzen™ with Radeon™ Vega Graphics/ Athlon™ with Radeon™ Vega Graphics Processors
Dual Channel Non-ECC Unbuffered DDR4, 2 DIMMs
PCIe Gen3 x4 M.2 with PCIe NVMe & SATA mode support
GbE LAN with Bandwidth Management
8-Channel HD Audio with High Quality Audio Capacitors
Smart Fan 5 features 5 Temperature Sensors and 2 Hybrid Fan Headers
GIGABYTE APP Center, Simple and Easy Use
NVMe PCIe Gen 3x4 22110 M.2 Connector
GIGABYTE Motherboards are focused on delivering M.2 technology to enthusiasts who want to maximize their system’s potential.
GbE LAN with Bandwidth Management
GbE LAN features a network bandwidth management application which helps to improve network latency and maintain low ping times to deliver better responsiveness in crowded LAN environments.
AUDIO
High-End Audio Capacitors
GIGABYTE motherboards use high-end audio capacitors. These high-quality capacitors help deliver high resolution and high-fidelity audio to provide the most realistic sound effects for gamers.
Audio Noise Guard
GIGABYTE motherboards feature an audio noise guard that essentially separates the board’s sensitive analog audio components from potential noise pollution at the PCB level.
Humidity Protection Glass Fabric PCB
There is nothing more harmful to the longevity of your PC than moisture, and most parts of the world experience moisture in the air as humidity at some point during the year. GIGABYTE motherboards have been designed to make sure that humidity is never an issue, incorporating a new Glass Fabric PCB technology that repels moisture caused by humid and damp conditions. Glass Fabric PCB technology uses a new PCB material which reduces the amount of space between the fiber weave, making it much more difficult for moisture to penetrate compared to traditional motherboard PCBs. This offers much better protection from short circuit and system malfunction caused by humid and damp conditions.
High Temperature Protection Lower RDS (on) MOSFETs Design
GIGABYTE motherboards use Low RDS (on) MOSFETs which reduce energy wastage through unnecessary residual heat dissipation. This all amounts to tangible energy savings which are beneficial for both end-users and the environment without impacting system performance.
SPECIFICATIONS:
CPU
AMD Socket AM4, support for: AMD Ryzen™ 5000 Series Processors/ AMD Ryzen™ 5000 G-Series Processors/ AMD Ryzen™ 4000 G-Series Processors/ 3rd Generation AMD Ryzen™ processors/ 2nd Generation AMD Ryzen™ processors/ 1st Generation AMD Ryzen™ processors/ 2nd Generation Ryzen™ with Radeon™ Vega Graphics processors/ 1st Generation Ryzen™ with Radeon™ Vega Graphics processors/ Athlon™ with Radeon™ Vega Graphics Processors
(Please refer "CPU Support List" for more information.)
Chipset
AMD B450
Memory
Support for DDR4 3600(O.C.)/3466(O.C.)/2933/2667/2400/2133 MHz memory modules
2 x DDR4 DIMM sockets supporting up to 64 GB (32 GB single DIMM capacity) of system memory
Dual channel memory architecture
Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode)
Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules
Support for Extreme Memory Profile (XMP) memory modules
(Please refer "Memory Support List" for more information.)
Onboard Graphics
Integrated Graphics Processor:
1 x HDMI port, supporting a maximum resolution of 4096x2160@60 Hz
Support for HDMI 2.0 version and HDCP 2.2.
Maximum shared memory of 16 GB
Audio
Realtek® Audio CODEC
High-Definition Audio
2/4/5.1/7.1-channel
You can change the functionality of an audio jack using the audio software. To configure 7.1-channel audio, access the audio software for audio settings.
LAN
Realtek® GbE LAN chip (1 Gbps/ 100 Mbps)
Expansion Slots
CPU: 1 x PCI Express x16 slot, supporting PCIe 3.0 and running at x16*
Actual support may vary by CPU.
Chipset: 1 x PCI Express x1 slot, supporting PCIe 2.0 and running at x1
Storage Interface
1 x M.2 connector (Socket 3, M key, type 22110/2280/2260/2242 SATA and PCIe 3.0 x4/x2(Note) SSD support)
* Refer to "2-7 Internal Connectors," for the installation notices for the M.2 connector.
4 x SATA 6Gb/s connectors
RAID 0, RAID 1, and RAID 10 support for NVMe SSD storage devices
RAID 0, RAID 1, and RAID 10 support for SATA storage devices
(Note) Supports only M.2 SATA SSDs when using an Athlon™ with Radeon™ Vega Graphics Processors.
USB
Chipset:
2 x USB 3.2 Gen 1 ports available through the internal USB header
6 x USB 2.0/1.1 ports (2 ports on the back panel, 4 ports available through the internal USB headers)
CPU:
4 x USB 3.2 Gen 1 ports on the back panel
Internal I/O Connectors
1 x 24-pin ATX main power connector
1 x 8-pin ATX 12V power connector
1 x CPU fan header
1 x system fan header
1 x M.2 Socket 3 connector
4 x SATA 6Gb/s connectors
1 x front panel header
1 x front panel audio header
1 x USB 3.2 Gen 1 header
2 x USB 2.0/1.1 headers
1 x Trusted Platform Module (TPM) header (2x6 pin, for the GC-TPM2.0_S module only)
1 x speaker header
1 x Clear CMOS jumper
1 x chassis intrusion header
Back Panel Connectors
1 x PS/2 keyboard port
1 x PS/2 mouse port
1 x HDMI 2.0 port
4 x USB 3.2 Gen 1 ports
2 x USB 2.0/1.1 ports
1 x RJ-45 port
3 x audio jacks
I/O Controller
iTE® I/O Controller Chip
H/W Monitoring
Voltage detection
Temperature detection
Fan speed detection
Fan fail warning
Fan speed control
Whether the fan speed control function is supported will depend on the cooler you install.
BIOS
1 x 128 Mbit flash
Use of licensed AMI UEFI BIOS
PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0
Unique Features
Support for APP Center
* Available applications in APP Center may vary by motherboard model. Supported functions of each application may also vary depending on motherboard specifications.
@BIOS
EasyTune
Smart Backup
System Information Viewer
Support for Q-Flash
Support for Xpress Install
Bundled Software
Norton® Internet Security (OEM version)
LAN bandwidth management software
Operating System
Support for Windows 11 64-bit
Support for Windows 10 64-bit
Support for Windows 7 64-bit
* To support Windows 7 64-bit, you must install an AMD Pinnacle Ridge & Summit Ridge CPU.
* Please download the "Windows USB Installation Tool" from GIGABYTE's website and install it before installing Windows 7.
Form Factor
Micro ATX Form Factor; 24.4cm x 19.5cm
Hiksemi HIKER is a line of SODIMM (Small Outline Dual In-line Memory Module) memory designed for laptops and other compact devices. The specific models you mentioned, HSC408S32Z1 and HSC416S32Z1, offer the following specifications:
Type:
DDR4
Frequency:
3200MHz
Capacity:
HSC408S32Z1: 8GB
HSC416S32Z1: 16GB
Form Factor:
SODIMM (for laptops and small form factor PCs)
Key Features:
High Speed:
The 3200MHz frequency provides faster data transfer rates, improving overall system performance.
Compatibility:
Designed to be compatible with a wide range of laptops and notebooks.
Reliability:
Built with high-quality components to ensure stability and durability.
Cost-Effective:
Offers good performance at a competitive price point.
